Patent · US Active

Method of forming an interface between components having different rates of expansion

US7736817B2 · kind B2 · utility

2Cited by
8References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 30, 2003
Grant dateJun 15, 2010
Priority date
Expiry dateMar 27, 2027

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02E60/50
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A method of forming an interface between components having different rates of volumetric expansion includes forming an interface surface of the interface with respect to a center of growth such that slippage occurs at the interface between the components during volumetric expansion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.