Method using a carrier for manufacturing a memory device and manufacturing method of a memory device using the same and memory device using the same
US7736947B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 25, 2007 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Jun 26, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A carrier including a bottom plate, an intermediate cover, and a top cover for manufacturing a memory device is introduced herein. A printed circuit board is disposed on the bottom plate, and memory elements are arranged and disposed on the PCB. The intermediate cover is used to press peripheral regions of the printed circuit board, and to expose the regions where the memory elements are formed on the printed circuit board. The printed circuit board is closely attached to a surface of the bottom plate by fixing the intermediate cover. The top cover is used to cover the memory elements formed on the printed circuit board after some manufacturing processes, and by exerting an external force, the formed memory elements are clamped down, so as to protect the memory elements from being affected by the printed circuit board in the following thermal process due to the thermal stress deformation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.