Circuit board and method of manufacturing circuit board
US7737368B2 · kind B2 · utility
5Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2006 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Feb 14, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes: a plurality of wiring layers; an insulating layer which insulates the plurality of wiring layers, the insulating layer containing a fibrous filler and a resin; and a conductor part formed on a sidewall of a via piercing through the insulating layer. The fibrous filler protrudes from the sidewall and is covered with the conductor part, with a length greater than the thickness of the conductor layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.