Semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode
US7737562B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2007 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Aug 8, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/93
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A collective substrate has through-holes. The through-holes each have an interior surface including taper surfaces which are tapered as having an opening size progressively decreasing from a main surface and an external connection surface toward a minimum size hole portion. A semiconductor element mount includes an insulative member cut out of the collective substrate. An imaging device includes an imaging element mounted in a region surrounded by a frame which is bonded to the main surface of the insulative member and closed by a cover. A light emitting diode component includes a light emitting element mounted on the main surface of the insulative member with the minimum size hole portion of the through-hole being filled with an electrically conductive material, the light emitting element being sealed with a fluorescent material and/or a protective resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.