Apparatus for hot-probing integrated semiconductor circuits on wafers
US7737713B2 · kind B2 · utility
1Cited by
13References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 10, 2006 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Jul 10, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2874
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for hot-probing integrated semiconductor circuits on wafers is disclosed that includes a support device for accommodating the wafer, a measurement card with electronic circuitry for functional verification of the integrated semiconductor circuits on the wafers, and a test head with contact needles which establishes an electrical contact between the measurement card and the integrated semiconductor circuits, wherein a detachable and coolable shield plate is provided between the measurement card and wafer in order to protect the apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.