Method and apparatus for thermal management of computer memory modules
US7738252B2 · kind B2 · utility
49Cited by
9References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 9, 2007 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Nov 11, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/206
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat spreader and method for thermal management of a computer memory module by promoting natural convection cooling of the memory module. The heat spreader includes a frame surrounding a planar body adapted to be mounted to a memory module of a computer, and a grid defined in the planar body by a plurality of uniformly distributed perforations. The perforations extend through the planar body to allow natural convention between an interior space beneath the planar body and an exterior space above the planar body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.