Multilayer substrate including components therein
US7738256B2 · kind B2 · utility
9Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2008 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | May 11, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a spot-faced portion. Passive components and an active component are disposed in the through-holes and the spot-faced portion, respectively. These components are connected to conductive patterns formed on wiring layers, with connecting vias therebetween. Contact faces of each component with the connecting vias are controlled so as to be disposed at the same level with the metal layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.