Circuit module and process for producing the same
US7738263B2 · kind B2 · utility
1Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2008 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Mar 9, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit module containing a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder, the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pads, and the dents being joined to the ceramic substrate pads with solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.