Heat dissipation device
US7740054B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 6, 2006 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Sep 22, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a heat dissipation fin module, a heat pipe and a centrifugal fan. The heat pipe is connected to the heat dissipation fin module at one end and connected to a heat generating source at an opposite end. The centrifugal fan includes a motor rotating a centrifugal impeller. A spiral housing encloses the centrifugal impeller and the motor. The spiral housing includes an air inlet, a first air outlet and a second air outlet. The air inlet exposes the centrifugal impeller such that the rotating centrifugal impeller introduces air through the air inlet. The first air outlet is connected to the heat dissipation fin module and the heat pipe, the second air outlet exposes the heat pipe. An isolation wall is disposed between the second air outlet and the air inlet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.