Solid state lighting apparatus utilizing axial thermal dissipation
US7740380B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Oct 29, 2008 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Oct 29, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A solid state lighting apparatus characterized by its compact, predominately axial form factor, utilizes an axial thermal transfer member constructed of Highly Oriented Pyrolytic Graphite (HOPG) to aid in the dissipation of waste heat generated during its operation. The lighting apparatus is chiefly comprised of a Light Emitting Diode (LED) die array and circuit structure assembly affixed to one end of the axial thermal transfer member and further includes a transversely mounted heat sink structure, running the length of, and being affixed to, opposite sides of the axial member. The axial member serves to distribute waste heat down its length, and simultaneously, into a transverse plane where the waste heat is dissipated into the transversely mounted heat sink structure. A fan may be utilized to evacuate the waste heat out of the lighting apparatus and into the ambient environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.