Low shrinkage epoxy-cationic curable compositions
US7740734B2 · kind B2 · utility
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1References
21Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 21, 2008 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Nov 28, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/42
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to compositions comprising an epoxy resin; a reagent selected from the group of cationic compounds or compounds which are capable to form cationic compounds or mixtures of those; at least one compound with two aromatic rings and at least one central cyclic oxygen bridged ring and the use of such compositions in adhesives, sealants and coatings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.