Photoresist transfer pads
US7741003B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2004 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Jun 8, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/313
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resist transfer pad and method of use are described for forming a uniform photoresist on the surface of a workpiece such as a slider. The resist transfer pad includes a layer of cured polydimethylsiloxane (PDMS) on a cushioning layer, e.g. silicone rubber, and an optional stiffening layer. The sliders are preferably mounted on a carrier or pallet. In one preferred embodiment the loaded resist transfer pads are applied to the slider surface by roll lamination where the loaded resist transfer pad is transported by a roller system using a cover-tape and pressed against the slider surface. Subsequently the cover-tape and the resist transfer pad are lifted off and the photoresist remains on the transducer. An alternative embodiment uses a vacuum, piston laminator to press the loaded resist transfer pad onto the surface of the transducer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.