Low gloss thermoformable flooring structure
US7741408B2 · kind B2 · utility
4Cited by
41References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2004 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Mar 26, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A novel flooring composition was developed based on a blend comprising: a) an elastomer; b) a random propylene/alpha-olefin copolymer; c) a cross linking agent; and optionally d) a melt strength enhancing polymer. This composition achieves a unique balance of properties, exhibiting often-conflicting performance requirements. These include low gloss and excellent pattern duplication in embossing, low modulus, minimal odor, excellent grain acceptance and abrasion resistance, while remaining thermoformable and maintaining minimal shift in viscosity during recycle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.