Electronic component and method for manufacturing the same
US7741565B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2007 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Sep 29, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F27/34
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In conventional electronic components, having a substrate as a component of the structure has been an obstacle to an ultra-low profile design. To address the problem, the present invention provides an improved structure without a substrate. Internal electrode 15 is formed into a predetermined coil pattern. Bumps 16 and irregularities 17 are formed on confronting surfaces of the component, by which each component is hard-to-cling with one another. On the other hand, the confronting side-surfaces with no bumps 16 or irregularities 17 allow a mounting device to have an improved vacuum suction force. Such structured electronic component maintains easy handling even when it is extremely downsized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.