Plastic surface mount large area power device
US7741706B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2006 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Mar 10, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A low profile, 1 or 2 die design, surface mount high power microelectronic package with coefficient of expansion (CTE) matched materials such as Silicon die to Molybdenum conductor (bond pads). The CTE matching of the materials in the package enables the device to withstand repeated, extreme temperature range cycling without failing or cracking. The package can be used for transient voltage suppression (TVS), Schottky diode, rectifier diode, or high voltage diodes, among other uses. The use of a heat sink metal conductor that has a very high modulus of elasticity allows for a very thin wall plastic locking to be utilized in order to minimize the footprint of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.