Embedded type multifunctional integrated structure for integrating protection components and method for manufacturing the same
US7741709B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2008 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Jul 28, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embedded type multifunctional integrated structure for integrating protection components and a method for manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrate more than two passive components on a component structure that is adhered onto a substrate and is applied to a USB terminal in order to protect an electronic device that uses the USB. Hence, the present invention has an OCP function, an OVP function, and an anti-ESD function at the same time. Therefore, the present invention effectively integrates two or more passive components in order to increase functionality. Moreover, the present invention effectively reduces the size of the passive components on a PCB and reduces the number of solder joints.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.