Integrated circuit bond pad structures
US7741716B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2005 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Jul 28, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Integrated circuit bond pads are provided for forming wire bonds to integrated circuit package pins. Each pad uses a bond pad structure that provides room for under-pad circuitry. The under-pad circuitry can be connected to other circuitry on the integrated circuit, thereby providing efficient use of circuit real estate. The bond pad structures are formed in the dielectric stack portion of the integrated circuit using dummy bond pads and bond pad support structures. Bond pad support structures may be formed from metal in metal interconnect layers. Vias may be used to connect the bond pad support structures to each other and to the dummy bond pads. Bond pad support structures may be formed in a polysilicon layer at the bottom of the dielectric stack. A contact layer contains metal plugs that connect the polysilicon bond pad support structures to the lowermost metal-layer bond pad support structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.