Piezo fans for cooling an electronic device
US7742299B2 · kind B2 · utility
58Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2008 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | May 15, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system including one or more piezo fans for an electronic assembly is disclosed. The electronic assembly may include heat-generating components coupled with a front side of a printed circuit board (PCB) and one or more piezo fans coupled with a back side of the PCB. One or more piezo fans may be capable of cooling the heat-generating components from the back side. The cooling system may further include a heat sink coupled with the back side of the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.