Electronic device and method of assembling an electronic device
US7742309B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2006 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Dec 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1322
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device and method of assembling an electronic device, said device including an electronic component; an electrically insulating protective layer overlaying and in contact with at least a portion of the electronic component; and injection molded material overlaying at least the portion of the component and the overlaying protective layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.