Electronic device and method of fabrication of a same
US7742312B2 · kind B2 · utility
0Cited by
4References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 3, 2007 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Apr 8, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31551
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An electronic device and method of fabrication are provided. The electronic device comprises a substrate, a patterned conductive layer serving as an antenna layer formed on the outer surface of the substrate, electrically connected with a printed circuit board (PCB) for sending or receiving a wireless signal, wherein the substrate is placed between the patterned conductive layer and PCB. The patterned conductive layer may be electrically connected to the PCB through a hole in the substrate by a connecting piece. The substrate may be a housing of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.