Patent · US Active

Method to planarize perpendicular write poles using a combination of CMP and reactive ion milling

US7743487B2 · kind B2 · utility

3Cited by

1References

19Claims

0Family size

Assignee

Hitachi Global Storage Technologies Netherlands B.V. · NL

Inventors

Amanda Baer · Campbell, US
Hamid Balamane · Portola Valley, US
Michael Feldbaum · San Jose, US
Ming Jiang · San Jose, US
Aron Pentek · San Jose, US
Neil Leslie Robertson · Campbell, US
Sue Siyang Zhang · Saratoga, US

Key dates

Filing date	Jun 14, 2006
Grant date	Jun 29, 2010
Priority date	—
Expiry date	Apr 17, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49052
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A perpendicular write head includes a beveled main pole having corners defining a track width and having a planarized surface and encapsulated on either side thereof and below by an alumina layer, the alumina layer having a polished surface and extending above the main pole on either side thereof as steps.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.