Structurally isolated thermal interface

US7743763B2 · kind B2 · utility

Assignee

• The Boeing Company · US

Inventors

• Robert Erik Grip · Rancho Palos Verdes, US
• Blaine Knight Rawdon · Riverside, US
• Gurpreet S. Jalewalia · Willow View Lane, US

Key dates

• Filing date: Jul 27, 2007
• Grant date: Jun 29, 2010
• Expiry date: Aug 10, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/50

Abstract

In one embodiment, an assembly having bodies of different thermal expansion rates comprises a first body, a second body having a different thermal expansion rate than the first body, and a plurality of high conductivity members attached to both the first and second bodies. The high conductivity members are more flexible than the first and second bodies in order to allow for varied thermal expansion of the first and second bodies. The assembly may comprise a solar collector assembly, wherein the first body is a solar cell attached to a substrate, and the second body is a heat sink.