Mold temperature control system
US7744362B2 · kind B2 · utility
1Cited by
6References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 18, 2006 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Apr 29, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/44
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A temperature control system (100) includes a heating system (1), a cooling system (2) and a control unit (3). The heating system has a heated fluid. The heated fluid is heated by a solar energy for increasing the mold temperature. The cooling system has a cooled fluid. The cooled fluid cools for decreasing the mold temperature. The control unit controls the heating system and the cooling system to be opened or closed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.