Overmolded electrical contact array
US7744380B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2007 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Feb 21, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/16
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention provides a connector incorporating an overmolded housing that may control the position of the mounting ends of the connector and may provide a structure to help transfer the forces for press fit of the connector to the printed circuit board (PCB). Such a connector may include a first leadframe assembly having a plurality of contacts, a second leadframe assembly having a plurality of contacts, an edge card, and a tail alignment housing. Each contact may include a lead portion and a mounting end. The lead portions of the contacts may engage the edge card. The tail alignment housing may include a housing body and a plurality of tail supports extending from the housing body. The tail alignment housing may be overmolded onto at least a portion of the mounting ends.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.