Process for enhancing the resolution of a thermally transferred pattern
US7744717B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2007 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Oct 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/655
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided are processes for enhancing the resolution of a thermally transferred pattern on an imaged thermal transfer receiver, wherein the imaged thermal transfer receiver comprises a surface having an exposed portion and a non-exposed portion of one or more thermally transferred layer(s), comprising: (a) contacting said surface with an adhesive layer for a contact period to provide a laminate; (b) separating said adhesive layer from the laminate to provide a treated thermal transfer receiver having a surface substantially free of said non-exposed portion of one or more thermally transferred layer(s). The processes are useful in the fabrication of electronic devices including thin film transistors, circuits, electromagnetic interference shields, touchpad sensors and other electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.