Microsystem component and method for gluing microcomponents to a substrate

US7744718B2 · kind B2 · utility

Assignee

• Technische Universitaet Braunschweig Carolo-Wilhelmina · DE

Inventors

• Stefan Boehm · Oberasbach, DE
• Klaus Dilger · Braunschweig, DE
• Elisabeth Stammen · Eschweiler, DE
• Frank Mund · Goldkronach, DE
• Gero Pokar · Braunschweig, DE
• Jan Wrege · Erlangen, DE

Key dates

• Filing date: Aug 6, 2004
• Grant date: Jun 29, 2010
• Expiry date: Jul 12, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/12042
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for gluing microcomponents to a substrate (1) during the production of microsystem components includes the steps of applying a reactive or non-reactive hot melt type adhesive (5) to the microcomponent (18) and/or the substrate (1), heating the hot melt type adhesive (5), and placing the microcomponent (18) onto the substrate (1). The hot melt type adhesive (5) is on the contact surfaces between the microcomponent (18) and the substrate (1) during and after gluing.