Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same
US7745013B2 · kind B2 · utility
5Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2005 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Apr 30, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12479
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed solder is used as a solder bump for communication between an integrated circuit device and external structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.