Manufacturing method of light-emitting element with surface layer removal
US7745240B2 · kind B2 · utility
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Key dates
| Filing date | Jul 12, 2007 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Jun 25, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/82
Abstract
A manufacturing method of a light-emitting element includes emitting a laser light to a division region for separating a light-emitting element formed on a substrate, physically dividing the substrate along the division region, and removing a surface layer on at least one of the side faces of the substrate that is exposed by the dividing of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.