Patent · US Active

Solder contacts and methods of forming same

US7745321B2 · kind B2 · utility

3Cited by

6References

11Claims

0Family size

Assignee

Qimonda AG · DE

Inventors

Alfred Martin · Munich, DE
Barbara Hasler · Munich, DE
Martin Franosch · Munich, DE
Klaus-Guenter Oppermann · Holzkirchen, DE

Key dates

Filing date	Jan 11, 2008
Grant date	Jun 29, 2010
Priority date	—
Expiry date	May 19, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/043
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit that comprises a substrate and a structured layer on the substrate. The structured layer comprises an opening to the substrate, a first field and a second field on the substrate, wherein the first field and the second field, at least in part, overlap with the opening. The integrated circuit further comprises a first material in the area of the first field and a second material in the area of the second field. The first material impedes a wetting by a solder material, and the second provides a wetting by the solder material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.