Method of clearing electrical contact pads in thin film sealed OLED devices
US7745340B2 · kind B2 · utility
2Cited by
3References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2005 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Jun 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process of cleaning wire bond pads associated with OLED devices, including the steps of depositing on the wire bond pads one or more layers of ablatable material, and ablating the one or more layers with a laser, thereby exposing a clean wire bond pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.