Composition of polyimide and sterically-hindered hydrophobic epoxy
US7745516B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2005 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Jan 4, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.