Bonding compositions
US7745545B2 · kind B2 · utility
4Cited by
42References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2007 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Sep 12, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3154
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Polymer bonding compositions having greater than about 1 milliequivalent primary amine/100 grams of the polymer, more preferably greater than about 3 milliequivalent non-tertiary amine/100 grams of the polymer. Preferably the polymer is not significantly crosslinked. These bonding compositions may be especially useful for bonding fluropolymers. Processes for making the novel polymers and the resulting multilayer bonded articles are described. The polymers include polymer-bonded ZNHLSi(OP)a(X)3-a-b(Y)b units. The bonding composition may be used for making multi-layer polymer laminates such as tubes and films and containers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.