Wiring component
US7745730B2 · kind B2 · utility
15Cited by
7References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 23, 2007 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Jul 31, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/5845
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A wiring component includes an array of multiple wires, at least one connector which engages the wires, and at least two layers of a hardened fiber and a filler compound that sandwiches the wires. The areas adjacent to the wires include a filler which immobilizes the wires relative to the layers. In one embodiment at least a portion of the connector is embedded in the filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.