Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink
US7745952B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2006 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | May 10, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/7072
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module constructs a pressurizing tool by laminating an elastic member as well as a DC positive-side wiring member and DC negative-side wiring member in which currents flow in opposite directions. The pressurizing tool presses a first fixing tool, and then the first fixing tool presses semiconductor equipment. The semiconductor equipment is fixed to a heat dissipating member with its heat dissipating surface brought into surface contact with side wall surfaces of the heat dissipating member.The power module can enhance heat dissipation between a heat dissipating member and semiconductor equipment, and enables the semiconductor equipment to be fixed to the heat dissipating member without adding other components to the power module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.