Integrated sensor
US7746056B2 · kind B2 · utility
126Cited by
85References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2009 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Jan 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/4903
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronic circuit includes a substrate having a surface and a device supported by the surface of the substrate. The electronic circuit also includes a magnetic field transducer disposed over the surface of the substrate and an insulating layer disposed between the substrate and the magnetic field transducer. The electronic circuit also includes a conductor disposed over the magnetic field transducer. The conductor is configured to carry an electrical current to generate a first magnetic field. The electronic circuit is responsive to the first magnetic field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.