Arrangement for cooling SMD power components on a printed circuit board
US7746650B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2007 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Nov 23, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is described an arrangement for cooling electrical components disposed on a board-shaped mounting substrate, particularly SMD power components on a printed circuit board, wherein at least one heat sink assigned to a component is present which is disposed on the same side as the components and which is connected in a thermally conductive manner to the assigned component by means of a thermally conductive layer implemented on the mounting substrate. The heat sink is implemented as a bent sheet-metal part and is connected to the thermally conductive layer by means of a solder joint, wherein the bent sheet-metal part has at least one heat sink element which extends in a longitudinal direction and said longitudinal direction is oriented obliquely to the plane of the board-shaped substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.