Head assignment modeling and simulation
US7747421B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2005 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | May 8, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
To model head assignments for a multihead composite material application machine having a set of heads, a ply geometry for a composite part is received and a configuration for the multihead composite material application machine is received. In addition, a constellation of head locations is generated in response to the ply geometry and the configuration for the multihead composite material application machine. Furthermore, a head location of the constellation of head locations is assigned to a corresponding head of the set of heads and a graphical model of the multihead composite material application machine applying the composite material upon the composite part is generated in response to the assigned head locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.