Method of forming a circuit board
US7748115B2 · kind B2 · utility
3Cited by
13References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2007 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Jan 16, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a circuit board, the method comprising mounting at least one passive component on a first surface of a first laminate material; interconnecting the passive component to contact traces and vias of the first laminate material; and attaching a second laminate material to the first surface of the first laminate material utilizing a lamination process, the second laminate material sheet having at least one of a recess, a through-hole or both formed therein for accommodating the passive component in the second laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.