Ejecting apparatus, applying method, manufacturing method of color filter substrate, manufacturing method of electroluminescence display apparatus, manufacturing method of plasma display apparatus, and manufacturing method of wire
US7748824B2 · kind B2 · utility
0Cited by
2References
5Claims
0Family size
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Key dates
| Filing date | Oct 14, 2004 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Dec 10, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/236
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An ejecting apparatus is provided for readily controlling ejection even when the number of nozzles is increased. In each of N heads in an ejecting apparatus, DA equals a distance between a first nozzle array and a second nozzle array, and a distance between the second nozzle array in one arbitrary head of the N heads and the first nozzle array in another head adjacent to this arbitrary head in the Y-axis direction is substantially equal to an integer multiple of DA.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.