Method of manufacturing fine features for thin film transistors
US7749396B2 · kind B2 · utility
3Cited by
8References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2006 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Apr 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/60
Abstract
A process for fabricating fine features such as small gate electrodes on a transistor. The process involves the jet-printing of a mask and the plating of a metal to fabricate sub-pixel and standard pixel size features in one layer. Printing creates a small sub-pixel size gap mask for plating a fine feature. A second printed mask may be used to protect the newly formed gate and etch standard pixel size lines connecting the small gates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.