Method and device for injection molding
US7749419B2 · kind B2 · utility
4Cited by
3References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2003 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Jan 7, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3055
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection-molding method including preparing a first die, a second die and a third die, sandwiching a separator proper with the first die and the second die, molding a front side molded layer by injecting silicone rubber into the front side cavity through a gate, replacing the second die with a third die while the front side molded layer is still soft, and molding a rear side molded layer by piercing the front side molded layer with an injection pressure injecting the silicone rubber through the gate and filling a rear side cavity with silicone rubber through the through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.