Die identification systems and methods
US7749690B2 · kind B2 · utility
4Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2004 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Apr 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods are disclosed herein to provide die identification. For example, in accordance with an embodiment of the present invention, a wafer patterning technique is disclosed that provides multiple-exposure patterning to provide a unique identifying mark for each die on a wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.