Integrated circuit having one or more conductive devices formed over a SAW and/or MEMS device
US7750420B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2005 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Jul 10, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/14588
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An integrated circuit is provided which includes one or more device elements formed above a base substrate, a structure forming a sealed cavity above at least a portion of the one or more device elements, and one or more conductive devices formed above the sealed cavity. A method for fabrication of such an integrated circuit is also provided. An exemplary embodiment of the integrated circuit includes a surface acoustic wave device having a plurality of tracks each with a first interdigitated transducer configured to convert a receiving electric field energy into mechanical wave energy and a second interdigitated transducer configured to convert the mechanical wave energy into an output electric field energy. The SAW device also includes a conductor arranged above and spanning across at least two tracks of the plurality of tracks and coupled to the first interdigitated transducers of at least the two tracks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.