Circuit substrate structure and circuit apparatus
US7750434B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2006 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Jan 16, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first wiring layer in a circuit substrate structure is provided with a first inductor and a second inductor. A dielectric layer is provided with a first via and a second via electrically connected to the first inductor and the second inductor, respectively. A second wiring layer is provided with: a bridge electrically connecting the first via and the second via; and a conductive pattern provided around the bridge, the outer edge of the conductive pattern being located outside the outer edge of the first wiring pattern and the second wiring pattern in the first wiring layer. The bridge functions as a coplanar line and suppresses generation of electromagnetic field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.