Conductive interconnects along the edge of a microelectronic device
US7750441B2 · kind B2 · utility
14Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2006 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Mar 18, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76898
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention include apparatuses and methods relating to conductive interconnects along the edges of a microelectronic device. In one embodiment, the conductive interconnect has the shape of a half cylinder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.