Semiconductor package and method for manufacturing the same
US7750448B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2008 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Sep 25, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a semiconductor device having a first main surface and a second main surface, a first electrode plate provided on the first main surface, a second electrode plate provided on the second main surface, and a wiring substrate provided between the semiconductor device and the first electrode plate, in which a plurality of opening portions in the side surface of a protruding portion provided on the first electrode plate are engaged respectively with a plurality of engaging portions which face the opening portions and which are provided on the inner side surface of an intrusion opening portion in the wiring substrate into which the protruding portion is intruded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.