Heatsink method and apparatus
US7751192B2 · kind B2 · utility
24Cited by
34References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2007 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Jan 9, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heatsink having tapered geometry that improves passive cooling efficiency is discussed. A tapered geometry between heatsink heat dissipation elements, as a function of distance along a z-axis opposing gravity, decreases resistance to rarification of passively flowing cooling gas upon heating. Thus, the tapered heatsink elements result in higher velocity of gas flow and increased cooling efficiency of the heatsink. Optionally, the heatsink is made from a thermally conductive polymer allowing the heatsink to be created in complex shapes using injection molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.