Circuit device, circuit module, and outdoor unit
US7751194B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 26, 2008 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Sep 26, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.