Fingerprint sensing assemblies and methods of making
US7751601B2 · kind B2 · utility
85Cited by
39References
31Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 4, 2005 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Oct 1, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint sensing module includes a sensor substrate having a sensing side and a circuit side, an image sensor including conductive traces on the circuit side of the sensor substrate, and a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate and electrically connected to the image sensor. The sensor substrate may be a flexible substrate. The module may include a velocity sensor on the sensor substrate or on a separate substrate. The module may further include a rigid substrate, and the sensor substrate may be affixed to the rigid substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.