Method and system for thermal process control
US7751908B2 · kind B2 · utility
6Cited by
9References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2004 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | May 13, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A thermal process system. The thermal process system comprises a thermal processor, a metrology tool, and a controller. The thermal processor performs a thermal process as defined by a heating model to form a film on a wafer surface. The metrology tool, interfaced with the thermal processor, inspects thickness of the film. The controller, coupled with the thermal processor and the metrology tool, generates the heating model of the thermal processor and calibrates the heating model according to a preset slope coefficient matrix and the measured thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.